Call for Special Sessions

Special Sessions S5

Knowledge Engineering & AI Application (KEAIA)

organizer :Prof. Li, Prof. Yang, Prof. Lu, Prof. Yeh
Institution :Chaoyang University of Technology, National Taipei University, Chaoyang University of Technology, Feng Chia University
E-mail :lhli@cyut.edu.tw, cyang@uTaipei.edu.tw, tclu@cyut.edu.tw, chunhyeh@fcu.edu.tw
This Special Session is organized for the emerging research, theories, applications, and problems in the field of knowledge engineering and Artificial Intelligence (AI). The explosive data growth from organization, commerce, and from the real world are highly unstructured, heterogeneous, and unpredictable. How to recognize and analyze these explosive information by using AI techniques and how to transform these unstructured data into knowledge need efforts from every domain. This Special Session will focus on the prospective technologies, models, systems, and applications in AI, Data Science, Generative AI, Knowledge recognition, knowledge engineering, case-based reasoning, AI-based information processing or recognition, autonomous, and data hiding. The aim is to collect the most recent advances in AI research for knowledge and for data science. This session (KEAIA) will bring researchers and experts together to present and discuss the latest developments and technical solutions concerning various aspects of advances in AI and knowledge engineering.

Topics/Areas

• Knowledge Engineering
• Data mining
• Data Science
• Ontologies and Autonomous
• Intelligent Systems
• Artificial Intelligence (AI)
• Machine learning systems
• Distributed AI algorithms and techniques
• Classification models
• Data Hiding
• Knowledge and Security
• Cloud/edge computing
• Performance evaluation
• Cognitive and Recognition for knowledge
• Applications, case studies, and real-world test beds
• Application of AI
• Generative AI
• Knowledge-based AI
• Inferencing and decision-making
• Awareness and recognition
Manuscripts should be submitted in PDF format and formatted using the IEEE 2-column format Paper submitted here